BGA heat sink

A   heat sink  is usually made by Copper or Aluminum alloy. It is a  passive heat sink  that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often  use air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels. In computers,   heat sinks are used to cool CPU s , GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LED lights),  where the heat dissipation ability of the component itself is insufficient to moderate its temperature.  

In more extreme lighting situations, some type of  active cooling  may be required. This may be due to high heat flux from nearby leds, small size or surface area that is unable to  conduct natural convection , or extremely high ambient temperature conditions. Any of these conditions may change the thermal budget of certain areas and require  active cooling systems . Various "standard methods" for  active electronic cooling  have been proposed or are also used for leds, although some special conditions apply to active   LED cooling . To date, the  led cooling system  has used or recommended the use of simple dc rotating fans, thermoelectric coolers (TEC), piezoelectric fans (PZF), synthetic jets (SJ) and   liquid cooling   (such as microchannels). Each of these has specific advantages, but there are also some disadvantages to the cooling lighting system. Active cooling of lighting has special requirements that are not required for every semiconductor application. For exa