BGA heat sink

Do you know the harm caused by IGBT module overheating?   IGBT module itself has a certain power, the module itself will generate heat, the overall performance and reliability of IGBT module are affected by temperature.   Design rules are often used to compare failure rate figures.According to the design guidelines, one of the design rules shows that the failure rate will double for every 10 ℃ rise in temperature when the component is operating in an environment above 65 ℃ .So cooling IGBT module is also extremely important work! IGBT module is high power semiconductor devices, loss power makes the heat more, combined with the IGBT junction temperature should not exceed 125 ℃, should not be long   term work at higher temperatures, usually large current through the IGBT module, switching frequency is higher, leads to the wastage of the IGBT device is big also, if the heat is not spread out in time, make the device junction temperature over 125 ℃, IGBT module should not be long-term w

Collection mode heat pipe and zipper fins at present there are mainly two kinds, respectively is welding (Solder) and wear a Fin (Fin Penetration), welding process of the interface zipper resistance is low, but the cost is higher, such as aluminum fins and copper heat pipe welding, basic need to electroplating processing of heat pipe, can with aluminum fins welded together, and welding is high also to craft requirement, welding uneven or internal bubble, heat transfer efficiency will be significantly impaired. Fin piercing is to let heat pipe directly through the Fin by mechanical means. This process is simple, but the technical requirements are no lower than that of welding, because it requires the heat Fin to have close contact with the heat pipe. If Fin piercing fails, not only the zipper efficiency will be greatly reduced, but the  zipper Fin  may even fall off directly.At the same time, in order to ensure that Fin array does not deform, Fin piercing process is often used in con

S kiving heat   sinks  are involved in many fields (such as large servers, computers, frequency converters, automobiles, refrigerators, large machines, medical, communications, radio and television equipment, military industry, etc.). S kiving fin technology originated from abroad, mainly used in aerospace, military, precision machine tools, electronic equipment and other sophisticated or high-precision industries.With the progress of science and technology and processing technology, S kiving fin  technology   has been gradually transferred to civilian use and applied to IT and  industrial heat sink   manufacturing industry.The principle is a whole piece of copper or aluminum according to needs, with a professional skived fin  machine cut out the standard spacing of heat sink fin, because of the use of precise skived fin  technology, integrated manufacturing, heat transfer medium stability, heat sink thickness is greatly reduced, under the same conditions the heat t ransfer   effect i

Liquid cold plate   has been relatively popular, for the use of manufacturers, the quality of the water cooling plate  can make an objective judgment is to improve the quality of equipment necessary ability.   Now let Lori the customized   liquid cold plate  manufacturer to  introduce to you, how to distinguish the quality of  cold plate  good or bad? 1.  Appearance. A product is like a person, a product is like a character.   Clothing reflects your taste and attitude towards life.   So does the product's appearance.   Basic requirements: uniform chamfer, no burr, comfortable feel, roughness shall not be greater than 6.3 (generally 3.2 for Lor i), no oil residue on the surface, no oxidation and discoloration. 2.  M aterial. In the fierce market competition, in order to reduce costs, some businesses use non-national standard materials for the base plate of liquid   cold plate .   The base plate of cold plate . is generally aluminum plate, some are made from waste al

BGA cooling  problems get more and more people enough attention, LORI  a China heat sink  manufacturer  has  launched a series of heat sink  products on the market, BGA m emory h eatsink is a h eatsink set specially designed for BGA chipset ,   w ell liked by customers, t his heat sink  product is Lori's first chip cooling product for a single chip in a long time. Although these two heat sink s are designed to   BGA encapsulated chip cooling,   the material and the price are different , o ne is made of aluminum, while the other is made of pure copper, so the prices are far different. We know that there are not many memory cooling modules that can be used for BGA packaging in the market before, and most players have to DIY. Now Lori has launched a cooling module that can be used for BGA packaging video memory. As for bga heat sink  modeling , you can match and put it in any way according to different cooling  interfaces, so as to achieve ideal regional cooling  effect.